Flexible Electronics News

SEMI, UCLA Offer Guide to Onshoring Advanced Packaging Sites

Guide offers insights into onshoring advanced packaging facilities in the US.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

SEMI announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights c...

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